Inside TGV – How This Tech Powers Next-Gen Semiconductor Packaging

Semiconductor packaging is evolving fast. As 3D integration takes center stage, the need for better substrates grows. Silicon substrates are no longer enough. Glass substrates, with TGV (Through Glass Via) tech, are stepping up. TGV is critical for 3D integration in glass substrates. It’s like a “bridge” that connects layers vertically, making it a game-changer for moving beyond silicon-based solutions. The…