Semiconductor packaging is evolving fast. As 3D integration takes center stage, the need for better substrates grows. Silicon substrates are no longer enough. Glass substrates, with TGV (Through Glass Via) tech, are stepping up.
TGV is critical for 3D integration in glass substrates. It’s like a “bridge” that connects layers vertically, making it a game-changer for moving beyond silicon-based solutions.
The Basics of TGV
TGV stands for Through Glass Via – vertical electrical links through glass. Unlike TSV (Through Silicon Via), it’s designed to replace silicon substrates in next-gen 3D integration.
It uses high-grade borosilicate or quartz glass. The process flow includes laser induction, etching, seed layer sputtering, electroplating to fill vias, CMP, RDL, and bumping. TGVs are tiny – 10μm to 100μm in diameter. For advanced uses, each wafer needs tens of thousands to millions of these vias, all metalized for conductivity.
TGV’s Core Processes
1.Glass substrate prep: Pick ultra-thin glass with specific composition, thickness, and surface quality.
2.Laser drilling/etching: Use femtosecond lasers or wet/dry etching to create micro-holes.
3.Insulation and seed layer deposition: Add an insulating layer on hole walls for electrical isolation. Then deposit a metal seed layer.
4.Electroplating: Fill vias fully with metal (mostly copper) via electroplating.
5.Surface planarization (CMP): Polish away excess metal for a flat glass surface.
6.RDL fabrication: Deposit insulation on the glass, pattern it, and electroplate wiring to form interconnect circuits.
7.Testing and dicing: Test the interconnected wafer, then cut into individual chiplets for further packaging.
Why TGV Matters
TGV outperforms TSV in key areas. It has better high-frequency properties, lower costs, simpler processes, stronger stability, and wider uses. These perks make it a top choice for next-gen semiconductor packaging.
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Tel: + 86-13806028623
Whatsapp:+86-13806028623
Email: ydf8801@163.com”
2025年7月7日
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